lab-member-pic
 

Md Obaidul Hossen

  • Ph.D Alumni

 mhossen3@gatech.edu
 
 

Biography

  • Ph.D. in Electrical and Computer Engineering, Georgia Institute of Technology
  • BS in Electrical and Electronic Engineering, Bangladesh University of Engineering and Technology, 2013

Research Interests

  • EDA simulator development
  • Power delivery network design
  • On-chip networks

Thesis HOSSEN-DISSERTATION-2019.pdf

All Publications

  1. Y. Hu, M. O. Hossen, Z. Wan, M.S. Bakir, and Y. Joshi, "Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap," in ASME. J. Electron. Packag., 143(3): 031007, Sep. 2021.

  2. A. Kaul, S. Kochupurackal Rajan, M. O. Hossen, G. S. May, and M. S. Bakir, "BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations," 70th IEEE Electronic Components and Technology Conf. (ECTC), Orlando, FL, May 2020.

  3. M. O. Hossen, B. Chava, G. Van der Plas, E. Beyne and M. S. Bakir, "Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and  μ TSVs," in IEEE Trans. on Electron Devices, Jan. 2020.

  4. Y. Zhang, M. O. Hossen, and M. S. Bakir, "Power delivery network modeling and benchmarking for emerging heterogeneous integration technologies," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 9, pp. 1825-1834, 2019.

  5. M. O. Hossen, J. L. Gonzalez, and M. S. Bakir, "Thermomechanical Analysis and Package-Level Optimization of Mechanically Flexible Interconnects for Interposer-on-Motherboard Assembly," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 12, pp. 2081-2089, 2018.

  6. M. O. Hossen, Y. Zhang, and M. Bakir, "Thermal-Power Delivery Network Co-analysis for Multi-Die Integration", in 27th IEEE Conf. on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, Oct. 2018.

  7. P. K. Jo, M. O. Hossen, X. Zhang, Y. Zhang, and M. S. Bakir, "Heterogeneous Multi-Die Stitching: Technology Demonstration and Design Considerations," in Proc. 68th IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, May. 2018.

  8. Y. Zhang, M. O. Hossen, and M. S. Bakir, "Power Delivery Network Benchmarking For Interposer and Bridge-chip Based 2.5-D Integration," in IEEE Electron Device Letters, vol. 39, no. 1, pp. 99-102, Dec. 2017