H. Oh, M. Swaminathan, G. S. May and M. S. Bakir, "Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water," in IEEE Trans. on Comp., Pack. and Manuf. Tech., Aug. 2020.

M. Zia, H. Oh, and M. S. Bakir, "Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3-D Solenoidal Micro-Inductors and Flexible I/Os," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 11, pp. 2039-2044, 2018.

 H. Oh, X. Zhang, P. K. Jo, G. S. May, and M. S. Bakir, "Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects," in Proc. IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Phoenix, AZ, Jan. 2017. (invited).

P. K. Jo, M. Zia, J. L. Gonzalez, H. Oh, and M. S. Bakir, "Design, fabrication, and characterization of dense compressible microinterconnects,"IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 7, pp. 1003-1010, May. 2017.

H. Oh, G. May, and M. Bakir, "Heterogeneous integrated microsystems with non-traditional through-silicon via technologies," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 7, no. 4, pp. 502-510, Mar. 2017.

V. Kumar, H. Oh, X. Zhang, L. Zheng, M. S. Bakir, and A. Naeemi, "Impact of on-chip interconnect on the performance of 3D integrated circuits with through silicon vias Part I," IEEE Transaction on Electron Devices, vol. 63, no. 6, pp. 2503-2509, June 2016

X. Zhang, V. Kumar, H. Oh, L. Zheng, G. May, A. Naeemi, and M. S. Bakir, "Impact of on-chip interconnect on the performance of 3D integrated circuits with through silicon vias Part II," IEEE Transactions on Electron Devices, vol. 63, no. 6, pp. 2510-2516, June 2016

H. Oh, X. Zhang, G. May, and M. Bakir, "High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed," in Proc. 66th IEEE Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May. 2016.

H. Oh, P. A. Thadesar, G. S. May, and M. S. Bakir, "Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers," IEEE Microw. Wirel. Components Lett., vol. 26, no. 3, pp. 168-170, Mar. 2016.

H. Oh, G. May, and M. Bakir, "Analysis of signal propagation through TSVs within distilled water for liquid-cooled microsystems," IEEE Transaction Electron Devices, vol. 63, no. 3, pp. 1176-1181, Mar. 2016.

H. Oh, Y. Zhang, L. Zheng, G. S. May, and M. S. Bakir, "Fabrication and characterization of electrical interconnects and microfluidic cooling for 3D ICs with silicon interposer," Heat Transf. Eng., vol. 7632, pp. 1-41, Dec. 2015 (Invited).

. H. Oh, G. May, and M. Bakir, "Silicon interposer platform with low-loss through-silicon vias using air," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), Sendai, Japan, Aug. 2015.

H. Oh, J. M. Gu, S. J. Hong, G. S. May, and M. S. Bakir, "High-aspect ratio through-silicon vias for the integration of microfluidic cooling with 3D microsystems," Microelectronic Engineering, vol. 142, pp. 30-35, July 2015.

X. Liu, P. Thadesar, C. Taylor, H. Oh, M. Kunz, N. Tamura, M. Bakir, and S. Sitaraman, "In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation," Applied Physics Letters, vol.105, no.11, p.112109, Sep. 2014.

H. Oh, Y. Zhang, L. Zheng, and M. Bakir,"Electrical interconnect and microfluidic cooling within 3D ICs and silicon interposer," in Proc. Int. Tech. Conf. and Expo. Packaging and Integration of Electronic and Photonic Microsystems and Int. Conf. Nanochannels, Microchannels, and Minichannels (InterPACKICNMM), Chicago, IL, Aug. 2014.

T. E. Sarvey, Y. Zhang, Y. Zhang, H. Oh, and M. S. Bakir, "Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems,"in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Orlando, FL, May 2014.

Y. Zhang, H. Oh, and M. Bakir, "Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), San Francisco, CA, Oct. 2013.

H. Oh, A. Dembla, Y. Zhang, and M. Bakir "High aspect ratio TSVs in micro-pinfin heat sinks for 3D ICs," in Proc. SRC TECHCON, Austin, TX, Sep. 2013.