@INPROCEEDINGS{7517532,
author={X. {Zhang} and M. H. {Nasr} and D. C. {Woodrum} and C. E. {Green} and P. A. {Kottke} and T. E. {Sarvey} and Y. K. {Joshi} and S. K. {Sitaraman} and A. G. {Fedorov} and M. S. {Bakir}},
booktitle={2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
title={Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins},
year={2016},
volume={},
number={},
pages={85-90},
keywords={boiling;convection;microfabrication;passivation;refrigerants;silicon compounds;thermal resistance;device reliability;thermomechanical simulations;pumping power;thermal resistance;coolant;R134a refrigerant;thermal isolation;passivation layer;resistance heaters;isolation air trenches;two-phase convective boiling;ultra-high power density;integrated micropin-fins;extreme-microgap;convective boiling experiments;hotspot cooler testbed;thermal characterization;microfabrication;SiO2;Thermal resistance;Resistance heating;Cooling;Surface resistance;Fluids;microfluidic cooling;high heat flux;two phase;heat sink;thermal testing;reliability},
doi={10.1109/ITHERM.2016.7517532},
ISSN={1087-9870},
month={May},}