@inproceedings{yang20103d,
  title={3D integration of CMOS and MEMS using mechanically flexible interconnects (MFI) and through silicon vias (TSV)},
  author={Yang, Hyung Suk and Bakir, Muhannad S},
  booktitle={2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)},
  pages={822--828},
  year={2010},
  organization={IEEE}
}