@INPROCEEDINGS{7159922,
author={D. C. {Woodrum} and T. {Sarvey} and M. S. {Bakir} and S. K. {Sitaraman}},
booktitle={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)},
title={Reliability study of micro-pin fin array for on-chip cooling},
year={2015},
volume={},
number={},
pages={2283-2287},
keywords={cooling;elemental semiconductors;integrated circuit reliability;refrigerants;silicon;micro-pin fin array;on-chip cooling;microelectronic devices;heat flux;thermal interface material;heat spreader;hot spots;Georgia Tech;fluid-thermal solutions;deionized water;refrigerants;quartz substrate;Si;Silicon;Glass;Bonding;Fluids;Arrays;Substrates;Stress},
doi={10.1109/ECTC.2015.7159922},
ISSN={2377-5726},
month={May},}