@INPROCEEDINGS{7517711,
author={R. {Abbaspour} and D. C. {Woodrum} and P. A. {Kottke} and T. E. {Sarvey} and C. E. {Green} and Y. K. {Joshi} and A. G. {Fedorov} and S. K. {Sitaraman} and M. S. {Bakir}},
booktitle={2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
title={Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management},
year={2016},
volume={},
number={},
pages={1388-1392},
keywords={active networks;heat sinks;microfluidics;temperature measurement;thermal management (packaging);mechanical modeling;chip junction temperature measurement;active circuits;background heat generation;heat removal;microfluidic heat sink;high performance thermal management;extreme-microgap hotspot flow;finned microgap;Silicon;Substrates;Stress;Heating;Fabrication;Heat sinks;Hotspot cooling;microfluidic cooling;boiling heat transfer;microgap;liquid cooling},
doi={10.1109/ITHERM.2016.7517711},
ISSN={1087-9870},
month={May},}