"@INPROCEEDINGS{11038024,
  author={Chung, Euichul and Manley, Madison and Zeng, Wanshu and Bakir, Muhannad S.},
  booktitle={2025 IEEE 75th Electronic Components and Technology Conference (ECTC)}, 
  title={Thermal Management of Heterogeneously Integrated HBM-GPU Module with Step Height Difference}, 
  year={2025},
  volume={},
  number={},
  pages={487-492},
  keywords={Couplings;Liquid cooling;Computational fluid dynamics;Graphics processing units;Thermal management;Electronic packaging thermal management;Electromagnetic compatibility;Thermal analysis;Copper;Trigeneration;High-bandwidth memory;graphics processing units;computational fluid dynamics (CFD);microfluidic cooling},
  doi={10.1109/ECTC51687.2025.00086}}"