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Rohan Sahay

  • Masters Alumni

 rsahay7@gatech.edu
 
 

Biography

  • MS in Electrical and Computer Engineering, Georgia Institute of Technology
  • BS in Electrical and Computer Engineering, VIT Vellore, India

Research Interests

  • 2.5D/3D Heterogeneous Integration
  • Direct copper bonding

Thesis SAHAY-THESIS-2024.pdf

All Publications

  1. C. -H. Kuo, M. Manley, D. Pal, R. Sahay, R. Kanjolia, J. Woodruff, M. S.  Bakir, A. C. Kummel, M. Moinpour and J. Spiefelman, "Selective Co ALD for Chiplet-to-Wafer and Wafer-to-Wafer Bonding," 2024 IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA, 2024, pp. 1-2, doi: 10.1109/IITC61274.2024.10732076.

  2. R. Sahay, D. Pal, A. Victor, C.-H. Kuo, M. Manley, H. Simka, A. Kummel and M. S. Bakir, "Inverse Hybrid Bonding with Metal Oxide Framework as Infill for Heterogeneous Integration," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1837-1840, doi: 10.1109/ECTC51529.2024.00307.

  3. C. -H. Kuo,  D. Pal, V. Wang, M. Manley, R. Sahay, R. Kanjolia, M. Moinpour, J. Woodruff, M. S.  Bakir, J. Spiefelman and A. C. Kummel, "Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydrazine for Inverse Hybrid Metal Bonding," 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA), HsinChu, Taiwan, 2024, pp. 1-2, doi: 10.1109/VLSITSA60681.2024.10546373.