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Ashita Victor

  • Ph.D Candidate

 avictor8@gatech.edu
 
 

Biography

  • PhD in Electrical and Computer Engineering, Georgia Institute of Technology
  • MS in Electrical and Computer Engineering, Georgia Institute of Technology
  • B.E in Electrical and Electronics Engineering, M. S. Ramaiah Institute of Technology, Bangalore, India

Research Interests

  • 2.5D and 3D Heterogeneous Integration
  • Micro/Nanofabrication

Thesis

All Publications

  1. R. Krishna, A. Victor, S. Penta, X. Chen, M. S. Bakir, N. S. Kim and E. Rosenbaum, "Yield-Aware Interposer Design for UCIe Interconnects," 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, ON, Canada, 2024, pp. 1-3, doi: 10.1109/EPEPS61853.2024.10753661.

  2. A. Victor and M. S. Bakir, "Tier Transfer of Ultra-thin Reconstituted-SiO2 Chiplet Tiers," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2025.3527427.

  3. M. Manley, A. Victor, H. Park, A. Kaul, M. Kathaperumal and M. S. Bakir, "Heterogeneous Integration Technologies for Artificial Intelligence Applications," in IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, vol. 10, pp. 89-97, 2024, doi: 10.1109/JXCDC.2024.3484958.

  4. R. Sahay, D. Pal, A. Victor, C.-H. Kuo, M. Manley, H. Simka, A. Kummel and M. S. Bakir, "Inverse Hybrid Bonding with Metal Oxide Framework as Infill for Heterogeneous Integration," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1837-1840, doi: 10.1109/ECTC51529.2024.00307

  5. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

  6. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.