lab-member-pic
 

Madison Manley

  • Ph.D Candidate

 madison.manley@gatech.edu
 
 

Biography

Madison is currently a Ph.D. student in the Electrical and Computer Engineering program at Georgia Tech. She received her bachelor's in electrical engineering at the University of Central Florida.

Research Interests

Thesis

All Publications

  1. C. -H. Kuo, M. Manley, D. Pal, R. Sahay, R. Kanjolia, J. Woodruff, M. S.  Bakir, A. C. Kummel, M. Moinpour and J. Spiefelman, "Selective Co ALD for Chiplet-to-Wafer and Wafer-to-Wafer Bonding," 2024 IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA, 2024, pp. 1-2, doi: 10.1109/IITC61274.2024.10732076.

  2. M. Manley, A. Victor, H. Park, A. Kaul, M. Kathaperumal and M. S. Bakir, "Heterogeneous Integration Technologies for Artificial Intelligence Applications," in IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, vol. 10, pp. 89-97, 2024, doi: 10.1109/JXCDC.2024.3484958.

  3. A. Kaul, M. Manley, J. Read, S. Yu and M. S. Bakir., "Co-Optimization for Robust Power Delivery Design in 3D-Heterogeneous Integration of Compute In-Memory Accelerators," 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Honolulu, HI, USA, 2024, pp. 1-2, doi: 10.1109/VLSITechnologyandCir46783.2024.10631345.

  4. M. Manley, A. Kaul and M. S. Bakir, "Design Space Exploration for Power Delivery Network in Next Generation 3D Heterogeneous Integration Architectures," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 2223-2228, doi: 10.1109/ECTC51529.2024.00378.

  5. R. Sahay, D. Pal, A. Victor, C.-H. Kuo, M. Manley, H. Simka, A. Kummel and M. S. Bakir, "Inverse Hybrid Bonding with Metal Oxide Framework as Infill for Heterogeneous Integration," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1837-1840, doi: 10.1109/ECTC51529.2024.00307.

  6. C. -H. Kuo,  D. Pal, V. Wang, M. Manley, R. Sahay, R. Kanjolia, M. Moinpour, J. Woodruff, M. S.  Bakir, J. Spiefelman and A. C. Kummel, "Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydrazine for Inverse Hybrid Metal Bonding," 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA), HsinChu, Taiwan, 2024, pp. 1-2, doi: 10.1109/VLSITSA60681.2024.10546373.

  7. J. Sharda, M. Manley, A. Kaul, W. Li, M. Bakir and S. Yu, "Design and Thermal Analysis of 2.5D and 3-D Integrated System of a CMOS Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving," in IEEE Journal of the Electron Devices Society, vol. 12, pp. 426-432, 2024, doi: 10.1109/JEDS.2024.3354621.

  8. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

  9. A. Kaul, M. O. Hossen, M. Manley and M. S. Bakir, "Design Considerations for Power Delivery Network and Metal-Insulator-Metal Capacitor Integration in Bridge-Chips for 2.5-D Heterogeneous Integration," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 985-990, doi: 10.1109/ECTC51909.2023.00168. 

  10. M. Manley, Z. J. Devereaux, V. Wang, C. Kuo, N. M. K. Linn, A. Kummel, C. H. Winter, and M. S. Bakir, "Towards Selective Cobalt Atomic Layer Deposition for Chip-to-Wafer 3D Heterogeneous Integration," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 374-378, doi: 10.1109/ECTC51909.2023.00069. 

  11. W. Li, M. Manley, J. Read, A. Kaul, M. S. Bakir and S. Yu, "H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 31, no. 10, pp. 1592-1602, Oct. 2023, doi: 10.1109/TVLSI.2023.3299509.

  12. J. Sharda, M. Manley, A. Kaul, W. Li, M. Bakir and S. Yu, "Thermal Modeling of 2.5D Integrated Package of CMOS Image Sensor and FPGA for Autonomous Driving," 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Seoul, Korea, Republic of, 2023, pp. 1-3, doi: 10.1109/EDTM55494.2023.10102948. 

  13. T. Zheng, M. Manley and M. Bakir, "Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1493-1498, doi: 10.1109/ECTC51909.2023.00253.

  14. A. Kaul, Y. Luo, X. Peng, M. Manley, Y.-C. Luo, S. Yu and M. S. Bakir, "3-D Heterogeneous Integration of RRAM-Based Compute-In-Memory: Impact of Integration Parameters on Inference Accuracy," in IEEE Transactions on Electron Devices, vol. 70, no. 2, pp. 485-492, Feb. 2023, doi: 10.1109/TED.2022.3231570.

  15. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.

  16. Z. J. Devereaux, M. Manley, M.-J. Li, J. Hollin, N. M. K. Linn, M. S. Bakir, A. Kummel and C. H. Winter, “Studies Toward Highly Selective Cobalt Metal ALD on Copper Features for Heterogeneous Chiplet Integration”, 6th Area Selective Deposition Workshop, San Francisco, CA, Apr. 2022.​

  17. M. Manley, A. Kaul, M. -J. Li and M. S. Bakir, "Ultra-Dense 3D Polylithic Integration Technology", Government Microcircuit Applications & Critical Technology Conf., Miami, FL, Mar. 2022.