lab-member-pic
 

Wanshu Zeng

  • Ph.D Student

 wanshu_zeng@gatech.edu
 
 

Biography

  • Ph.D. student in Electrical and Computer Engineering, Georgia Institute of Technology 
  • M.S. in Electronic Packaging, Huazhong University of Science and Technology 
  • B.S. in Electronic Packaging, Huazhong University of Science and Technology 

Research Interests

  • 2.5D/ 3D Heterogenous Integration 

Thesis

All Publications

  1. E. Chung, M. Manley, W. Zeng and M. S. Bakir, "Thermal Management of Heterogeneously Integrated HBM-GPU Module with Step Height Difference," 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, USA, 2025, pp. 487-492, doi: 10.1109/ECTC51687.2025.00086.