lab-member-pic
 

Ting Zheng

  • Ph.D Alumni

 ting.zheng@gatech.edu
 
 

Biography

  • Ph.D. in Electrical and Computer Engineering, Georgia Institute of Technology
  • MS in Electrical and Computer Engineering, Georgia Institute of Technology
  • BS in Microelectronics, Nanjing University

Research Interests

  • 2.5D/3D Heterogeneous Integration
  • RF/mm-wave modeling and characterization
  • Flexible Interconnect

Thesis ZHENG-DISSERTATION-2023.pdf

All Publications

  1. S. Penta et al., "Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 274-278, doi: 10.1109/ECTC51529.2024.00052. 

  2. T. Zheng and M. S. Bakir, "Electrical Demonstration of an RF Embedded Multi-Chip Module Enabled by Fused-Silica Stitch-Chip Technology," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3395538

  3. S. Oh, T. Zheng and M. S. Bakir, "Electrical Characterization of Shielded TSVs with Airgap Isolation for RF/mmWave Applications," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3358102.

  4. T. Zheng and M. S. Bakir, "Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips with Compressible Microinterconnects for RF/mm-Wave Chiplet Based Modules," in IEEE Transactions on Components, Packaging and Manufacturing Technology.

  5. T. Zheng, M. Manley and M. Bakir, "Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, May 2023, pp. 1493-1498.

  6. T. Zheng and M. S. Bakir, "Benchmarking Frequency-Dependent Parasitics of Fine-Pitch Off-Chip I/Os for 2.5D and 3D Heterogeneous Integration," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 12, pp. 2002-2012, Dec. 2022.

  7. T. Zheng and M. S. Bakir, “Fused-Silica Stitch-Chips with Compressible Microinterconnects for Embedded RF/mm-wave Chiplets”, in 2022 IEEE/MTT-S International Microwave Symposium (IMS), Denver, CO, Jun. 2022.

  8. J. R. Brescia, J. L. Gonzalez, T. Zheng and M. S. Bakir, "Replaceable Integrated Chiplet (PINCH) Assembly for Heterogeneous Integration", Government Microcircuit Applications & Critical Technology Conf., Miami, FL, Mar. 2022.

  9. T. Zheng, A. Kaul, S. Kochupurackal Rajan, and M. S. Bakir, "Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations," in B. Keser, and S. Kröhnert (Ed.), Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces (pp. 261-287) Wiley, 2021.

  10. J. L. Gonzalez, J. R. Brescia, T. Zheng, S. Kochupurackal Rajan and M. S. Bakir, "A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2069-2076, Dec. 2021.

  11. T. Zheng, P. K. Jo, S. Kochupurackal Rajan and M. S. Bakir, "Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 11, pp. 1824-1834, Nov. 2021.

  12. Y. Wang, C. Swank, T. Zheng, J. F. Buckwalter, A. Kummel, M. Rodwell and M. S. Bakir, “Interposer and Advanced Packaging Enabled by Ultra-Dense Microdiamond Composites for RF/mm-wave Applications”, in Proceeding of TECHCON 2021, Sep. 2021.

  13. T. Zheng, P. K. Jo, S. Kochupurackal Rajan, and M. S. Bakir, "Polylithic integration for RF/mm-wave chiplets using stitch-chips: modeling, fabrication, and characterization," 2020 IEEE MTT-S International Microwave Symposium (IMS), Los Angeles, CA, Jun. 2020.

  14. J. L. Gonzalez, T. Zheng, S. Kochupurackal Rajan, and M. S. Bakir, “Package Testing using a Socketed Heterogeneous 2.5D/3D Integration Module (SHIM) for mm-wave Applications,” Proceedings of the 2020 GOMAC-Tech – Government Microcircuit Applications and Critical Technology Conference, 2020.

  15. P. K. Jo, T. Zheng, and M. S. Bakir, "Polylithic Integration of 2.5D and 3D Chiplets Using Interconnect Stitching," in Proc. 69th IEEE Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May. 2019.

  16. P. K. Jo, T. Zheng, and M. S. Bakir, "Multi-Die Polylithic Integration Enabled by Heterogeneous Interconnect Stitching Technology (HIST)," in 27th IEEE Conf. on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, Oct. 2018.