Biography
- MS in Electrical and Computer Engineering, Georgia Institute of Technology
- B.E. (Hons.) in Electrical and Electronics Engineering, BITS Pilani
- Pronouns: He/Him
Research Interests
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2.5D and 3D Heterogeneous Integration
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Fan-out Wafer level Packaging
Thesis
All Publications
R. Krishna, A. Victor, S. Penta, X. Chen, M. S. Bakir, N. S. Kim and E. Rosenbaum, "Yield-Aware Interposer Design for UCIe Interconnects," 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, ON, Canada, 2024, pp. 1-3, doi: 10.1109/EPEPS61853.2024.10753661.
S. Penta, T. Zheng, E. Tremble, A. Chakravarti, A. Sigler, Z. Zhang, C. Benes, M. S. Bakir and W. Sauter, "Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 274-278, doi: 10.1109/ECTC51529.2024.00052.