C. Zhang, H. S. Yang, and M. S. Bakir, "A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects," Journal of Micromechanics and Microengineering, vol. 27, no. 2, pp. 025014-1-025014-6, Jan. 2017.

M. Zia, C. Zhang, H.S. Yang, L. Zheng and Muhannad Bakir, "Chip-to-chip interconnect integration technologies," IEICE Electron. Express, vol. 13, no. 6, pp. 1-16, Mar. 2016.

H. S. Yang, C. Zhang, and M. S. Bakir, "A self-aligning flip-chip assembly method using sacrificial positive self-alignment structures," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 3, pp. 471-477, Feb. 2016.

C. Zhang, H. S. Yang, H. D. Thacker, I. Shubin, J. E. Cunningham, and M. S. Bakir, "Mechanically flexible interconnects with contact tip for rematable heterogeneous system integration," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 11, pp. 1587-1594, Oct. 2016.

Y. Zhang, Y. Zhang, T. E. Sarvey, C. Zhang, M. Zia, M. S. Bakir, "Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3D ICs," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6. no. 1, pp. 31-39, Dec. 2015.

 M. Zia, T. Chi, C. Zhang, P. Thadesar, T. Hookway, J. Gonzalez, T. McDevitt, H. Wang, and M. S. Bakir, "A microfabricated electronic microplate platform for low-cost repeatable bio-sensing applications," in Proc. IEEE International Electron Devices Meeting (IEDM), Washington, DC, Dec. 2015.

. M. Zia, C. Zhang, P. Thadesar, T. Hookway, T. Chi, J. Gonzalez, T. McDevitt, H. Wang,  and M. S. Bakir, "Fabrication of and cell growth on silicon membranes with high density TSVs for bio-sensing applications," in Proc. IEEE Biomedical Circuits and Systems Conference (BioCAS), Atlanta, GA, Oct. 2015.

C. Zhang, P. Thadesar, M. Zia, T. E. Sarvey, and M. S. Bakir, "Au-NiW mechanically flexible interconnects (MFIs) for rematable 3D integration," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), Cork, Ireland, Dec. 2014.

H. S. Yang, C. Zhang, and M. Bakir, "Self-aligned silicon interposer tiles and silicon bridges using positive self-alignment structures and rematable mechanically flexible interconnects", IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 4, no. 11, pp. 1760-1768, Nov. 2014.

H. S. Yang, C. Zhang, and M. Bakir, "Self-aligning silicon interposer tiles and silicon bridges for large nanophotonics enabled systems", Electronics Letters, vol. 50, no. 20, pp. 1475-1477, Sep. 2014.

C. Zhang, H.S. Yang, M. Bakir, "Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection," in Proc. 64th IEEE Electronic Components and Technology Conf. (ECTC), Orlando, FL, May 2014.

H. S. Yang, C. Zhang, M. Zia, L. Zheng, M. Bakir, "Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge," in Proc. IEEE Photonics Society Optical Interconnects Conf., Coronado, CA, May 2014.

C. Zhang, H. S. Yang, and M. Bakir, "Mechanically flexible interconnects (MFIs) with highly scalable pitch," Journal of Micromechanics and Microengineering, vol. 24, no. 5, pp. 055024, May 2014.

C. Zhang, H. S. Yang, and M. Bakir, "Highly elastic gold passivated mechanically flexible interconnects," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 3, no. 10, pp. 1632-1639, Oct. 2013.

H.S. Yang, C. Zhang, M.S. Bakir, "A low-cost self-alignment structures for heterogeneous 3D integration," in Proc. 63rd IEEE Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May 2013.

H. S. Yang, P. Thadesar, C. Zhang, M.S. Bakir, (2013). Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration. In L. A. Francis and K. Iniewski (Ed.), Novel Advances in Microsystems Technologies and Their Applications (1st ed., p45-p68). FL, USA: CRC Press

H. S. Yang, P. Thadesar, C. Zhang, M.S. Bakir, (2013). Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration. In V. Choudhary and K. Iniewski (Ed.), MEMS: Fundamental Technology and Applications (1st ed., p111-p130). FL, USA: CRC Press

C. Zhang, H. S. Yang, and M. Bakir, "Gold passivated mechanically flexible interconnects (MFIs) with high elastic deformation," in Proc. 62nd IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, 2012.

M. Bakir, P. Thadesar, C. King, J. Zaveri, H. Yang, C. Zhang, Y. Zhang, "Revolutionary innovation in system interconnection: A new era for the IC," in Proc. Photonics West, Proc. of SPIE, Feb. 2011.