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Ashita Victor

  • Ph.D Candidate

 avictor8@gatech.edu
 
 

Biography

  • PhD in Electrical and Computer Engineering, Georgia Institute of Technology
  • MS in Electrical and Computer Engineering, Georgia Institute of Technology
  • B.E in Electrical and Electronics Engineering, M. S. Ramaiah Institute of Technology, Bangalore, India

Research Interests

  • 2.5D and 3D Heterogeneous Integration
  • Micro/Nanofabrication

Thesis

All Publications

  1. R. Krishna et al., "Yield-Aware Interposer Design for UCIe Interconnects," 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, ON, Canada, 2024, pp. 1-3, doi: 10.1109/EPEPS61853.2024.10753661.

  2. A. Victor and M. S. Bakir, "Tier Transfer of Ultra-thin Reconstituted-SiO2 Chiplet Tiers," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2025.3527427.

  3. M. Manley, A. Victor, H. Park, A. Kaul, M. Kathaperumal and M. S. Bakir, "Heterogeneous Integration Technologies for Artificial Intelligence Applications," in IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, vol. 10, pp. 89-97, 2024, doi: 10.1109/JXCDC.2024.3484958.

  4. R. Sahay et al., "Inverse Hybrid Bonding with Metal Oxide Framework as Infill for Heterogeneous Integration," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1837-1840, doi: 10.1109/ECTC51529.2024.00307

  5. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

  6. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.