Biography
- Ph.D. student in Electrical and Computer Engineering, Georgia Institute of Technology
- BS in Electrical Engineering, University of Illinois at Urbana-Champaign
- BE in Electrical Engineering and Automation, Zhejiang University
Research Interests
- 2.5D/3D Heterogeneous Integration
- RF/mm-wave modeling and characterization
Thesis
All Publications
S. Penta, T. Zheng, E. Tremble, A. Chakravarti, A. Sigler, Z. Zhang, C. Benes, M. S. Bakir and W. Sauter, "Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 274-278, doi: 10.1109/ECTC51529.2024.00052.